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  Datasheet File OCR Text:
 September 2001
Optical Communication Devices
2.5 Gb/s Optical Receiver
TOAD347-RXB/TOAD347-RXC Series
APPLICATION FEATURES
* SONET / SDH (OC-48 / STM-16) applications * APD and TIA Mini-DIL package without thermistor * TOAD347-RXB: Mini-DIL package with thermistor * TOAD347-RXC: output * Differential data voltage: +3.3 V to +5 V * Single power supply (Typ. @ BER = 1 x 10 ) -33 dBm * Sensitivity:-8 dBm (Typ. @ BER = 1 x 10 ) * Overload: case temperature range: -40 to +85 C * Operatingsize: 7.4 (W) x 13.2 (D) x 4.6 (H) mm * Package
-10 -10
TOAD347-RXB/TOAD347-RXC Series
TOAD347-RXB/TOAD347-RXC Series
ABSOLUTE MAXIMUM RATINGS (Tc = 25 C)
Item Storage temperature Operating case temperature APD forward current APD reverse current Positive supply voltage Soldering temperature / time Symbol Tstg Tc If Ir Vdd Tsol / tsol Rating -40 to +85 -40 to +85 1 500 0 to +6 260 / 5 Unit C C mA A V C / s
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tc = -40 to +85 C, Vdd = +3.3 V to +5 V)
Item Positive supply current Breakdown voltage (Id = 10 A, Tc = 25C) Dark current (M = 12, Tc = 25C) Sensitivity Overload Bandwidth (-3 dB) Logic sense Skew, DATA OUT (+) to DATA OUT (-) Optical return loss Output signal amplitude Electrical return loss 9 Thermistor resistance (TOAD347-RXC, Tc = 25C) 9.5 -- 10.0 -- 10.5 dB k (7) (8) -20 -- 15 10 -- -- -- -- 20 -27 500 -- ps dB mVpp dB (4) (5) (6) Min -- 35 -- -- -- 1.4 Typ. 50 -- 40 -33 -8 2.0 Max -- 85 100 -- -- -- Unit mA V nA dBm dBm GHz (1) (1) (2) (3) Note
Notes: (1) 2.48832 Gb/s, NRZ, PRBS 231-1, BER = 1 x 10-10, = 1.55 m (2) Pf = -30 dBm, M = 12 (3) DATA OUT (+), Light ON = Vout Logic HIGH DATA OUT (-), Light ON = Vout Logic LOW (4) = 1.3/1.55 m (5) -10 dBm > Pf > -30 dBm (6) 0.13 GHz < F < 1.75 GHz (7) 1.75 GHz < F < 2.5 GHz (8) 3 k (typ.) available
DIMENSIONAL OUTLINE AND PIN ASSIGNMENT
(Unit: mm)
o4.2 2.15 3.0 1 8 2.54 x 3 = 7.62 13.21
4 0.4
5 (1.68) 4.32
5max
7.37
7.87 6.7
(1.68)
0.5 (typ.)
4.32
Pin Assignment (TOAD347-RXB)
Pin 1 2 3 4 Function Vapd GND DATA OUT (+) GND Pin 5 6 7 8 Function GND DATA OUT (-) GND Vdd (+3.3 V to +5 V)
Pin Assignment (TOAD347-RXC)
Pin 1 2 3 4 Function Vapd GND DATA OUT (+) GND Pin 5 6 7 8 Function Thermistor DATA OUT (-) GND Vdd (+3.3 V to +5 V)
PRECAUTIONS
(a) Power supply: Transient electric spike may cause a damage to the photodiode or IC chips. A surge-free power supply and a slow starter circuit should be used. To avoid causing an electrical surge, pins should not be connected or disconnected on the test fixture before turning the power off. (b) The product should be grounded for obtaininng the performance.
4.62
9.0
OVERSEAS SUBSIDIARIES AND AFFILIATES
Toshiba America Electronic Components, Inc.
Headquarters-Irvine, CA
9775 Toledo Way, Irvine, CA 92618, U.S.A. Tel: (949)455-2000 Fax: (949)859-3963
010126 (X)
Toshiba Electronics Europe GmbH
Dusseldorf Head Office
Hansaallee 181, D-40549 Dusseldorf Germany Tel: (0211)5296-0 Fax: (0211)5296-400
Toshiba Electronics Asia, Ltd.
Hong Kong Head Office
Level 11, Top Glory Insurance Building, Grand Century Place, No.193, Prince Edward Road West, Mong Kok, Kowloon, Hong Kong Tel: 2375-6111 Fax: 2375-0969
Deerfield, IL(Chicago)
One Pkwy., North, Suite 500, Deerfield, IL 60015-2547, U.S.A. Tel: (847)945-1500 Fax: (847)945-1044
Toshiba Electronics Italiana S.R.L.
Centro Direzionale Colleoni Palazzo Perseo Ingr. 2-Piano 6, Via Paracelso n.12, 1-20041 Agrate Brianza Milan, Italy Tel: (039)68701 Fax:(039)6870205
Beijing Office
Rm 714, Beijing Fortune Building, No.5 Dong San Huan Bei-Lu, Chao Yang District, Beijing, 100004, China Tel: (010)6590-8795 Fax: (010)6590-8791
Edison, NJ
2035 Lincoln Hwy. Ste. #3000, Edison NJ 08817, U.S.A. Tel: (732)248-8070 Fax: (732)248-8030
Toshiba Electronics(UK) Limited
Riverside Way, Camberley Surrey, GU15 3YA, U.K. Tel: (01276)69-4600 Fax: (01276)69-4800
Toshiba Electronics Korea Corporation
Seoul Head Office
14/F, KEC B/D, 257-7 Yangjae-Dong, Seocho-ku, Seoul, Korea Tel: (02)589-4334 Fax: (02)589-4302
Raleigh, NC
5511 Capitol Center Dr., #114, Raleigh, NC 27606, U.S.A. Tel: (919)859-2800 Fax: (919)859-2898
Toshiba Electronics Scandinavia AB
Gustavslundsvagen 12, 2nd Floor S-161 15 Bromma, Sweden Tel: (08)704-0900 Fax: (08)80-8459
Richardson, TX(Dallas)
777 East Campbell Rd., Suite 650, Richardson, TX 75081, U.S.A. Tel: (972)480-0470 Fax: (972)235-4114
Toshiba Technology Development (Shanghai) Co., Ltd.
23F, Shanghai Senmao International Building, 101 Yin Cheng East Road, Pudong New Area, Shanghai, 200120, China Tel: (021)6841-0666 Fax: (021)6841-5002
Wakefield, MA(Boston)
401 Edgewater Place, Suite #360, Wakefield, MA 01880-6229, U.S.A. Tel: (781)224-0074 Fax: (781)224-1095
Toshiba Electronics Taiwan Corporation
Taipei Head Office
17F, Union Enterprise Plaza Bldg. 109 Min Sheng East Rd., Section 3, 0446 Taipei, Taiwan Tel: (02)514-9988 Fax: (02)514-7892
The information contained herein is subject to change without notice. The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. The Toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These Toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of Toshiba products listed in this document shall be made at the customeris own risk.
Electronic Devices Sales & Marketing Division
1-1, Shibaura 1-chome, Minato-ku, Tokyo, 105-8001, Japan Tel: +81-3-3457-3405 Fax: +81-3-5444-9431
The products described in this document are subject to the foreign exchange and foreign trade laws. Gallium arsenide (GaAs) is a substance used in some of the products described in this documents. GaAs dust and fumes are toxic. Do not break, cut or pulverize the products, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage.
Website: http://www.semicon.toshiba.co.jp/eng/index.html
(c)2001 TOSHIBA CORPORATION Printed in Japan


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